What’s This All About? Go Big or Go Home!
ASML and TSMC are making waves in the sector by striving to enlarge their photomasks to 12 inches. These heavyweights are confident that this will reduce expenses and resolve the challenges associated with high-NA EUV lithography. Now, ASML, the Dutch experts in EUV technology, have partnered with TSMC to gear up for larger photomasks. Intel and Samsung are joining the ranks as well, turning it into quite the gathering.
Aspirations for Growth, Larger Masks
The vision is to establish a pilot line for 12-inch masks by 2031, with all the sophisticated systems ready for advanced production by 2033. Initially, they will stick with the standard 6-inch masks, but the ambition is to transition to the 12-inch versions to enhance output and eliminate those annoying stitching issues. It’s all about maximizing efficiency without getting bogged down by complex components.
The Technical Aspect: Light Management
Now for the technical details – we’re referring to ‘NA’, which stands for numerical aperture, indicative of how effectively an optical system can capture and focus light. ASML is utilizing larger optics, which results in light hitting at a sharper angle, leading to shadowing challenges on the masks. They could have opted for larger optics, reducing mask patterns by 8x in both dimensions, but that required bigger masks. Instead, they chose a hybrid strategy – 4x in one dimension, 8x in the other. It may not be flawless, but it keeps the industry functioning for the time being.
The Stitch in Time Concept
The outcome of this combination is a reduced exposure field, implying that larger dies may necessitate double exposures in a crafty manner, introducing more complexity and diminishing productivity. This is where the larger masks come into play – they aim to broaden the exposure field and enable chipmakers to create denser chips with smaller process nodes. TSMC has yet to venture into high-NA EUV, but they’re eyeing 2030 for their big reveal.
All Aboard: Intel and Samsung Participate
Intel is on board with their EVP Naga Chandrasekaran showing eagerness for this shift. They’re focused on facilitating high-NA on 6-inch masks before transitioning to the 6×12-inch versions. Concurrently, Samsung aims to lead this high-NA EUV innovation in their DRAM production by 2028. Good for them! Samsung believes the AI boom is transforming the chip landscape, and they’re staying partnered with ASML for future advancements.
Voices from the Industry
According to IDC’s Andrew Buss, high-NA EUV offers both challenges and opportunities. While stitching and chiplet designs serve as stopgaps, moving to 6×12-inch photomasks resembles the industry’s shift from 200 mm to 300 mm wafers. Buss emphasizes the importance of collaboration among toolmakers, chip producers, mask suppliers, and other industry stakeholders to synchronize their technologies and processes for success.
Conclusion: Larger Masks, Grand Aspirations, Greater Challenges
ASML and TSMC are making a significant investment in these 12-inch masks to address some of the issues in chip manufacturing. With Intel and Samsung in the mix, it’s an impressive lineup. Let’s just hope they don’t face any stumbling blocks while pursuing these goals, right? Here’s to hoping these oversized advancements propel the industry forward without the typical technological snags.
